安森美半導體發佈2019年第4季度及全年業績

2019年第4季度業績摘要：

• 總收入1,401.8百萬美元
  
• 公認會計原則 (GAAP)和非公認會計原則(non-GAAP)毛利率為34.6%
  
• GAAP營運毛利率為9.9%，non-GAAP營運毛利率為12.3%
  
• 營運現金流為91.7百萬美元及可用的流動現金為 -20.7百萬美元
  
• GAAP每股攤薄盈利為$0.14美元，non-GAAP每股攤薄盈利為$0.30美元
  

2019年業績摘要：

• 總收入5,517.9百萬美元
  
• 毛利率為35.8%，non-GAAP毛利率為36.1%
  
• GAAP營運毛利率為7.8%，non-GAAP營運毛利率為14.1%
  
• 營運現金流為694.7百萬美元及可用的流動現金為 160.1百萬美元
  
• GAAP每股攤薄盈利為$0.51美元，non-GAAP每股攤薄盈利為$1.49美元
  

【2020年2月4日】安森美半導體公司 (ON Semiconductor Corporation，美國納斯達克上市代號：ON) 於美國時間2月3日公佈，2019年第4季度總收入為1,401.8百萬美元，較去年同一季度下跌約7%。2019年第4季度的收入較2019年第3季度上升約1%。

安森美半導體總裁暨首席執行官Keith Jackson表示：「我們2019年的業績驗證公司業務的轉型性質，在充滿挑戰的宏觀經濟和地緣政治環境下，我們預期將超越大多數同儕。相信我們在汽車、工業和雲端電源半導體終端市場的強大競爭地位以及投入配合這些市場的長期趨勢仍是我們卓越業績的關鍵驅動力。除了強勁的營收表現，我們正在採取實質性措施，對製造業務進行結構性改變，並加快300mm晶圓廠的投入生產進度表，來擴大利潤。」

「第4季度，我們看到業務趨勢略有改善，且這改善持續到了2020年第1季度。隨著宏觀經濟和地緣政治條件的改善，安森美半導體憑藉強固的產品陣容及投入最具吸引力的半導體終端市場，並持續改進成本結構，處於有利地位將可獲取強勁的中短期業績。」

第4季度業績（GAAP）
（百萬美元，   每股數據除外）	2019年第4季度	2018年第4季度*	同比變動	2019年第3季度	環比變動
收入	$1,401.8	$1,503.1	-7%	$1,381.8	1%
毛利	$485.7	$569.7	-15%	$475.2	2%
營運收入	$138.9	$222.7	-38%	$-43.9	-416%
安森美半導體公司應占收入淨額	$56.5	$165.6	-66%	$-60.7	-193%
每股攤薄盈利	$0.14	$0.39	-64%	$-0.15	-193%
攤薄股數	418.2	420.0	-%	410.4	2%

第4季度業績（non-GAAP）
（百萬美元）	2019年第4季度	2018年第4季度*	同比變動	2019年第3季度	環比變動
收入	$1,401.8	$1,503.1	-7%	$1,381.8	1%
毛利	$485.7	$570.3	-15%	$494.2	-2%
營運收入	$172.1	$253.0	-32%	$179.9	-4%
安森美半導體公司   應占收入淨額	$124.3	$222.0	-44%	$136.8	-9%
每股攤薄盈利	$0.30	$0.53	-43%	$0.33	-9%
攤薄股數	413.1	420.0	-2%	412.3	-%

第4季度主要流動現金項目
（百萬美元）	2019年第4季度	2018年第4季度*	同比變動	2018年第3季度	環比變動
現金稅(扣除賠償)	$16.7	$8.2	104%	$14.1	18%
營運現金流	$91.7	$421.0	-78%	$242.2	-62%
可用的流動現金	$-20.7	$289.0	-107%	$130.5	-116%

2020年第1季度展望

按現時產品訂單趨勢、未完成訂單水準和估計周轉水準，本公司預計2020年第1季度的收入總額將約為1,355百萬美元至1,405百萬美元。

預計2020年第1季度的GAAP和non-GAAP毛利率將在33.7%至34.7%之間。

2020年第1季度的展望包括以股票支付報酬的預期支出約19百萬美元至21百萬美元。預期繳付所得稅的淨現金為14百萬美元至18百萬美元。

下表概列安森美半導體2020年第1季度的GAAP及non-GAAP展望。

	安森美半導體GAAP    總額	特別專案***	安森美半導體non-GAAP總額****
收入	$1,355百萬美元至   $1,405 百萬美元	-	$1,355百萬美元至   $1,405百萬美元
毛利率	33.7%至34.7%	-	33.7%至34.7%
營運支出	$357百萬美元至   $377百萬美元	$30百萬美元至   $34百萬美元*	$327百萬美元至   $343百萬美元
其他收入及支出淨額（包括利息支出）	$38百萬美元至   $41百萬美元	$9百萬美元至   $10百萬美元*	$29百萬美元至   $31百萬美元
攤薄股數*	418百萬	5百萬**	413百萬

FINANCIALS

*Convertible Notes, Non-cash Interest Expense is calculated pursuant to FASB’sAccounting Standards Codification Topic 470: Debt.

** Diluted share count can vary as a resultof, among other things, the actual exercise of options or vesting of restrictedstock units, the incremental dilutive shares from the Company's convertiblesenior subordinated notes, and the repurchase or the issuance of stock orconvertible notes or the sale of treasury shares. In periods in which thequarterly average stock price per share exceeds $18.50, the non-GAAP dilutedshare count and non-GAAP net income per share includes the impact of theCompany’s hedge transactions issued concurrently with our 1.00% convertiblenotes. As such, at an average stock price per share between $18.50 and $25.96,the hedging activity offsets the potentially dilutive effect of the 1.00%convertible notes. In periods when the quarterly average stock price per shareexceeds $20.72, the non-GAAP diluted share count and non-GAAP net income pershare includes the anti-dilutive impact of the Company’s hedge transactionsissued concurrently with the 1.625% convertible notes. As such, at an averagestock price per share between $20.72 and $30.70, the hedging activity offsetsthe potentially dilutive effect of the 1.625% convertible notes. Both GAAP andnon-GAAP diluted share counts are based on the Company’s stock price as ofDecember 31, 2019.

*** Special items may include: amortization ofacquisition-related intangibles; expensing of appraised inventory fair marketvalue step-up; purchased in-process research and development expenses;restructuring, asset impairments and other, net; goodwill impairment charges;gains and losses on debt prepayment; non-cash interest expense; actuarial(gains) losses on pension plans and other pension benefits; and certain otherspecial items, as necessary. These special items are out of our control andcould change significantly from period to period. As a result, we are not ableto reasonably estimate and separately present the individual impact of thesespecial items, and we are similarly unable to provide a reconciliation of thenon-GAAP measures. The reconciliation that is unavailable would include aforward looking income statement, balance sheet and statement of cash flows inaccordance with GAAP. For this reason, we use a projected range of theaggregate amount of special items in order to calculate our projected non-GAAPoperating expense outlook.

**** We believe these non-GAAP measuresprovide important supplemental information to investors. We use these measures,together with GAAP measures, for internal managerial purposes and as a means toevaluate period-to-period comparisons. However, we do not, and you should not,rely on non-GAAP financial measures alone as measures of our performance. Webelieve that non-GAAP financial measures reflect an additional way of viewingaspects of our operations that, when taken together with GAAP results and thereconciliations to corresponding GAAP financial measures that we also providein our releases, provide a more complete understanding of factors and trendsaffecting our business. Because non-GAAP financial measures are notstandardized, it may not be possible to compare these financial measures withother companies' non-GAAP financial measures, even if they have similar names.

電話會議

安森美半導體已於美國時間2020年2月3日美國東部時間 (EST)上午9時為金融界舉行電話會議，討論安森美半導體2019年第4季度及全年的業績。英語電話會議將在公司網站http://www.onsemi.com的「投資者關係」網頁作即時廣播。即時網上廣播大約1小時後在該網站重播，為時30天。投資者及有興趣者如想參加業績報告英語電話會議，請撥877-356-3762 (美國/加拿大)，或1-262-558-6155(國際)，並提供該會議的ID號碼 —9592878。

關於安森美半導體
安森美半導體（ONSemiconductor，美國納斯達克上市代號：ON）致力於推動高效能電子的創新，使客戶能夠減少全球的能源使用。安森美半導體是基於半導體的解決方案之領導供應商，提供全面性的高效能電源管理、類比、感測器、邏輯、時序、連線、離散元件、系統單晶片（SoC）及客製化元件。安森美半導體的產品幫助工程師解決在汽車、通訊、運算、消費性電子、工業、醫療、航空及國防應用的獨特設計挑戰。安森美半導體擁有敏銳、可靠、世界一流的供應鏈及品質專案，及一套嚴謹的審查標準和道德規範計畫，在北美、歐洲和亞太地區的關鍵市場的營運網路更包括製造廠、銷售辦公室和設計中心。欲瞭解更多資訊請參閱：http://www.onsemi.com。

•在 Twitter 上追蹤安森美半導體：www.twitter.com/onsemi

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安森美半導體和安森美半導體圖標是 Semiconductor Components Industries, LLC 的註冊商標。所有本文中出現的其他品牌和產品名稱分別為其相應持有人的註冊商標或商標。雖然公司在本新聞稿提及其網站，但此稿並不包含其網站中有關的資訊。

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